Product Overview

The BGM210PA32JIA2 is a high-performance Bluetooth module designed for line-powered IoT devices, built on the EFR32BG21 SoC. It supports Bluetooth 5.3 and Bluetooth Mesh connectivity, offering excellent RF performance, advanced security, and reliable environmental adaptability, ideal for scenarios requiring low power consumption, long-range communication, and high security.

Key Features

• Robust Wireless Performance: Supports +20 dBm transmit power and -97.0 dBm receive sensitivity (1 Mbps), enabling stable long-range communication.
• Efficient Processing: Integrated with a 32-bit ARM Cortex-M33 core (38.4 MHz) and 1024 kB Flash/96 kB RAM, balancing high performance and low power consumption.
• Multi-layer Security: Equipped with Secure Vault Mid security architecture, supporting secure boot, hardware encryption acceleration (AES, ECC, etc.), True Random Number Generator (TRNG), and anti-tamper design.
• Wide Temperature Operation: Operates in a temperature range of -40°C to +125°C, suitable for harsh environments like industrial and outdoor applications.
• Flexible Development: Built-in antenna and RF pin for external antenna compatibility, with global regulatory certifications (CE, FCC, SRRC, etc.) to simplify product deployment.

Technical Specifications

Typical Applications

• Smart Home: Used in smart sockets and thermostats, enabling low-power interconnection via Bluetooth 5.3 and Mesh networking for extended coverage and stable communication.
• Connected Lighting: Compatible with smart bulbs and strips, leveraging high sensitivity and low power for remote control and scene 联动，facilitating energy-efficient lighting systems.
• Building Automation: Applied in access control and sensor networks, supporting wide-temperature operation and secure encryption to ensure reliable and safe data transmission.
• Factory Automation: In industrial sensors and machine monitoring, the strong RF performance and anti-interference capability enable efficient device communication in complex industrial environments.

Why Choose BGM210PA32JIA2?

• Superior RF Performance: The combination of +20 dBm transmit power and high sensitivity ensures long-range connectivity in the 2.4 GHz ISM band.
• Industrial-grade Reliability: Supports -40°C to +125°C operation, meeting the needs for continuous work in harsh environments.
• Advanced Security: Hardware-level encryption and Secure Vault Mid architecture protect against data tampering and malicious attacks.
• Multi-protocol Compatibility: Supports Bluetooth 5.3 and Mesh, compatible with existing Bluetooth ecosystems for easy device networking and function expansion.
• Simplified Development: Pre-integrated software stacks, global certifications, and development tools (e.g., SLWSTK6102A Starter Kit) accelerate time-to-market.

SUNTOP COMPANY INTRODUCTION

Founded in 2000, Suntop is one of the leading global distributors of electronic
components, dedica ted to providing comprehensive procurement and supply chain services to the global electronics manufacturing industry. Our services include distribution, spot trading, PPV cost-saving projects, and inventory management. We not only offer high-quality products but also strive to assist our clients in achieving optimal solutions with minimal time and cost.
As a trusted partner for numerous OEMs, ODMs, CEMs, and EMS companies worldwide, our professional team manages millions of component records from thousands of trading partners across dozens of countries daily through our company database. We maintain close business relationships with major factories and distributors in North America, Europe, and Asia to ensure that our clients stay ahead in a highly competitive market.